Manufacturer | Chip Quik Inc. |
Form | Spool, 0.176 oz (5g) |
Type | Wire Solder |
Process | Lead Free |
Diameter | 0.006" (0.15mm) |
Flux Type | No-Clean, Water Soluble |
Mesh Type | - |
Shelf Life | - |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
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