Manufacturer | Chip Quik Inc. |
Form | Jar |
Type | Solder Sphere |
Process | Leaded |
Diameter | 0.012" (0.31mm) |
Flux Type | - |
Mesh Type | - |
Shelf Life | 24 Months |
Wire Gauge | - |
Composition | Sn63Pb37 (63/37) |
Melting Point | 361°F (183°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Kester Solder
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.