Manufacturer | Chip Quik Inc. |
Form | Jar, 8.8 oz (250g) |
Type | Solder Paste |
Process | Lead Free |
Diameter | - |
Flux Type | Water Soluble |
Mesh Type | 3 |
Shelf Life | 6 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Kester Solder
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
SRA Soldering Products
Chip Quik Inc.
Chip Quik Inc.
SRA Soldering Products
Kester Solder
Chip Quik Inc.
Chip Quik Inc.