Manufacturer | Chip Quik Inc. |
Form | Syringe, 1.23 oz (34.869g) |
Type | Solder Paste |
Process | - |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 4 |
Shelf Life | 12 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423°F (217°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
MG Chemicals
Chip Quik Inc.
Chip Quik Inc.
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Kester Solder
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MG Chemicals
SRA Soldering Products
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.