Manufacturer | Chip Quik Inc. |
Form | Spool, 4 oz (113.40g) |
Type | Wire Solder |
Process | Lead Free |
Diameter | 0.031" (0.79mm) |
Flux Type | No-Clean, Water Soluble |
Mesh Type | - |
Shelf Life | - |
Wire Gauge | 20 AWG, 22 SWG |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Chip Quik Inc.
MG Chemicals
Chip Quik Inc.
Chip Quik Inc.
MG Chemicals
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.