Manufacturer | Chip Quik Inc. |
Form | Jar, 0.53 oz (15g) |
Type | Solder Paste, Two Part Mix |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 4 |
Shelf Life | 24 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
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