Manufacturer | Kester Solder |
Form | Spool, 1 lb (454 g) |
Type | Wire Solder |
Process | Leaded |
Diameter | 0.031" (0.79mm) |
Flux Type | Rosin Mildly Activated (RMA) |
Mesh Type | - |
Shelf Life | - |
Wire Gauge | 20 AWG, 22 SWG |
Composition | Sn63Pb37 (63/37) |
Melting Point | 361°F (183°C) |
Product Status | Active |
Shelf Life Start | - |
Storage/Refrigeration Temperature | 50°F ~ 104°F (10°C ~ 40°C) |
Chip Quik Inc.
MG Chemicals
Chip Quik Inc.
Kester Solder
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
MG Chemicals
Chip Quik Inc.
Kester Solder
Chip Quik Inc.