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XC17S50APDG8C Specifications
Manufacturer AMD Xilinx
Memory Size 500kb
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)
Product Status Obsolete
Voltage - Supply 3V ~ 3.6V
Programmable Type OTP
Operating Temperature 0°C ~ 70°C
Supplier Device Package 8-PDIP
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XC17S50APDG8C Packaging
  • step1-Inspect Products step1: Inspect Products
  • step2-Vacuum-Packaging step2: Vacuum Packaging
  • step3-Anti-Static Bag step3: Anti-Static Bag
  • step4-Individual Packing step4: Individual Packing
  • step5-Packing Box step5: Packing Box
  • step6-shipping tag step6:Shipping Tag
  • Before shipping, we will inspect the parts to ensure it in good condition and check that the parts are brand-new and original with the datasheet. And then, all the products will be packed in an anti-static bag.
    After ensuring that there are no issues with any of the goods after packing, we will wrap them carefully and send them by international express. It demonstrates exceptional seal integrity, outstanding tear and puncture resistance, and both.
Manufacturer Overview

Xilinx is a leading provider of programmable logic devices and associated technologies. As a top producer of programmable FPGAs, SoCs, MPSoCs, and 3D ICs, Xilinx has expanded quickly. Software defined and hardware optimized applications are supported by Xilinx, advancing the fields of cloud computing, SDN/NFV, video/vision, industrial IoT, and 5G wireless.

One of Xilinx's key innovations is the development of the Xilinx Vivado Design Suite, a comprehensive software toolchain used for designing and programming their FPGAs and SoCs. This suite provides developers with the necessary tools to create, simulate, and implement their designs on Xilinx devices.

In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry. This acquisition has enabled AMD to enhance its product portfolio and expand its offerings into the rapidly growing FPGA market.

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