Manufacturer | Chip Quik Inc. |
Form | Jar, 1.76 oz (50g) |
Type | Solder Paste |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 3 |
Shelf Life | 6 Months |
Wire Gauge | - |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Melting Point | 281°F (138°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
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