Manufacturer | Chip Quik Inc. |
Form | Jar |
Type | Solder Sphere |
Process | Lead Free |
Diameter | 0.024" (0.61mm) |
Flux Type | - |
Mesh Type | - |
Shelf Life | 24 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |
Kester Solder
MG Chemicals
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
MG Chemicals
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
MG Chemicals
Chip Quik Inc.