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ORT8850L-3BMN680C

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ORT8850L-3BMN680C details
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ORT8850L-3BMN680C Specifications
Manufacturer Lattice Semiconductor Corporation
Mounting Type Surface Mount
Number of I/O 278
Package / Case 680-BBGA
Product Status Obsolete
Total RAM Bits 75776
Number of Gates 397000
Voltage - Supply 1.425V ~ 3.6V
Number of LABs/CLBs -
Operating Temperature 0°C ~ 70°C (TA)
Supplier Device Package 680-FPBGA (35x35)
Number of Logic Elements/Cells 4992

ORT8850L-3BMN680C FPGAs Overview

Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed a solution for designers who need the many advantages of FPGA-based design implementation, coupled with highspeed serial backplane data transfer. Built on the Series 4 reconfigurable embedded System-on-a-Chip (SoC) architecture, the ORT8850L-3BMN680C is made up of backplane transceivers (SERDES) containing eight channels, each operating at up to 850 Mbits/s (6.8 Gbits/s when all eight channels are used). This is combined with a full-duplex synchronous interface, with built-in Clock and Data Recovery (CDR) in standard-cell logic, along with over 600K usable FPGA system gates (ORT8850H). With the addition of protocol and access logic such as protocol-independent framers, Asynchronous Transfer Mode (ATM) framers, Packet-over-SONET (PoS) interfaces, and framers for HDLC for Internet Protocol (IP), designers can build a configurable interface retaining proven backplane driver/receiver technology. Designers can also use the device to drive high-speed data transfer across buses within a system that are not SONET/SDH based. For example, designers can build a 6.8 Gbits/s PCI-to-PCI half bridge using our PCI soft core.

The ORT8850L-3BMN680C device offers a clockless High-Speed Interface for inter-device communication on a board or across a backplane. The built-in clock recovery of the ORT8850L-3BMN680C allows for higher system performance, easier-to-design clock domains in a multiboard system, and fewer signals on the backplane. Network designers will benefit from the backplane transceiver as a network termination device. The backplane transceiver offers SONET scrambling/descrambling of data and streamlined SONET framing, pointer moving, and transport overhead handling, plus the programmable logic to terminate the network into proprietary systems. For non-SONET applications, all SONET functionality is hidden from the user and no prior networking knowledge is required.

The Lattice Programmable Logic ICs series ORT8850L-3BMN680C is FPGA - Field Programmable Gate Array 4992 LUT 278 I/O, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.

Features

Embedded Core Features

• Implemented in an ORCA Series 4 FPGA.

• Allows a wide range of high-speed backplane applications, including SONET transport and termination.
• No knowledge of SONET/SDH needed in generic applications. Simply supply data, 78 MHz—106 MHz clock, and a frame pulse.
• High-Speed Interface (HSI) function for clock/data recovery serial backplane data transfer without external clocks.
• Eight-channel HSI function provides 850 Mbits/s serial interface per channel for a total chip bandwidth of 6.8 Gbits/s (full duplex).
• HSI function uses Lattice’s 850 Mbits/s serial interface core. Rates from 126 Mbits/s to 850 Mbits/s are supported.
• LVDS I/Os compliant with EIA-644 support hot insertion. All embedded LVDS I/Os include both input and output on-board termination to allow long-haul driving of backplanes.
• Low-power 1.5 V HSI core.
• Low-power LVDS buffers.
• Programmable STS-3, and STS-12 framing.
• Independent STS-3, and STS-12 data streams per quad channels.
• 8:1 data multiplexing/demultiplexing for 106.25 MHz byte-wide data processing in FPGA logic.
• On-chip, Phase-Lock Loop (PLL) clock meets (type B) jitter tolerance specification of ITU-T recommendation G.958.
• Powerdown option of HSI receiver on a per-channel basis.
• HSI automatically recovers from loss-of-clock once its reference clock returns to normal operating state.
• Frame alignment across multiple ORT8850 devices for work/protect switching at OC-192/STM-64 and above rates.
• In-band management and configuration through transport overhead extraction/insertion.
• Supports transparent modes where either the only insertion is A1/A2 framing bytes, or no bytes are inserted.
• Streamlined pointer processor (pointer mover) for 8 kHz frame alignment to system clocks.
• Built-in boundry scan (IEEE 1149.1 JTAG).
• FIFOs align incoming data across all eight channels (two groups of four channels or four groups of two channels) for both SONET scrambling. Optional ability to bypass alignment FIFOs.
• 1 + 1 protection supports STS-12/STS-48 redundancy by either software or hardware control for protection
switching applications. STS-192 and above rates are supported through multiple devices.
• ORCA FPGA soft intellectual property core support for a variety of applications.
• Programmable Synchronous Transport Module (STM) pointer mover bypass mode.
• Programmable STM framer bypass mode.
• Programmable Clock and Data Recovery (CDR) bypass mode (clocked LVDS High-Speed Interface).
• Redundant outputs and multiplexed redundant inputs for CDR I/Os allow for implementation of eight channelswith redundancy on a single device.
FPGA Features
• High-performance platform design:
– 0.16 µm 7-level metal technology.
– Internal performance of >250 MHz.
– Over 600K FPGA system gates (ORT8850H).
– Meets multiple I/O interface standards.
– 1.5 V operation (30% less power than 1.8 V operation) translates to greater performance.
• Traditional I/O selections:
– LVTTL (3.3V) and LVCMOS (2.5 V and 1.8 V) I/Os.
– Per pin-selectable I/O clamping diodes provide 3.3 V PCI compliance.
– Individually programmable drive capability: 24 mA sink/12 mA source, 12 mA sink/6 mA source, or 6 mA sink/3 mA source.
– Two slew rates supported (fast and slew-limited).
– Fast-capture input latch and input flip-flop/latch for reduced input setup time and zero hold time.
– Fast open-drain drive capability.
– Capability to register 3-state enable signal.
– Off-chip clock drive capability.
– Two-input function generator in output path.
• New programmable high-speed I/O:
– Single-ended: GTL, GTL+, PECL, SSTL3/2 (class I & II), HSTL (Class I, III, IV), ZBT, and DDR.
– Double-ended: LVDS, bused-LVDS, LVPECL.
– LVDS include optional on-chip termination resistor per I/O and on-chip reference generation.
• New capability to (de)multiplex I/O signals:
– New Double-Data Rate (DDR) on both input and output at rates up to 350 MHz (700 Mbits/s effective rate).
– New 2x and 4x downlink and uplink capability per I/O (i.e., 50 MHz internal to 200 MHz I/O).
• Enhanced twin-quad Programmable Function Unit (PFU):
– Eight 16-bit Look-Up Tables (LUTs) per PFU.
– Nine user registers per PFU, one following each LUT, and organized to allow two nibbles to act independently, plus one extra for arithmetic operations.
– New register control in each PFU has two independent programmable clocks, clock enables, local SET/RESET, and data selects.
– New LUT structure allows flexible combinations of LUT4, LUT5, new LUT6, 4 → 1 MUX, new 8 → 1 MUX, and ripple mode arithmetic functions in the same PFU.
– 32 x 4 RAM per PFU, configurable as single- or dual-port. Create large, fast RAM/ROM blocks (128 x 8 in only eight PFUs) using the SLIC decoders as bank drivers.
– Soft-Wired LUTs (SWL) allow fast cascading of up to three levels of LUT logic in a single PFU through fast internal routing, which reduces routing congestion and improves speed.
– Flexible fast access to PFU inputs from routing.
– Fast-carry logic and routing to all four adjacent PFUs for nibble-wide, byte-wide, or longer arithmetic functions, with the option to register the PFU carry-out.
• Abundant high-speed buffered and nonbuffered routing resources provide 2x average speed improvements over previous architectures.
• Hierarchical routing optimized for both local and global routing with dedicated routing resources. This results in
faster routing times with predictable and efficient performance.
• SLIC provides eight 3-State Buffers, up to 10-bit decoder, and PAL-like AND-OR-INVERT (AOI) in each programmable logic cell.
• Improved built-in clock management with dual-output Programmable Phase-Locked Loops (PPLLs) provide optimum clock modification and conditioning for phase, frequency, and duty cycle from 15 MHz up to 420 MHz. Multiplication of the input frequency up to 64x, and division of the input frequency down to 1/64x possible.

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A temperature transducer is a sensor that can sense temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. After entering the 21st century, temperature sensors are rapidly developing towards high-tech directions such as high precision, multi-function, bus standardization, high reliability and safety, development of virtual sensors and network sensors, and development of single-chip temperature measurement systems. The bus technology of the temperature sensor has also been standardized, and it can be used as a slave to communicate with the host through a dedicated bus interface. According to the measurement method, it can be divided into two categories: a contact type and a non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. Main Category The detection part of the contact temperature sensor is in good contact with the measured object, also known as a thermometer. The thermometer achieves heat balance through conduction or convection so that the indication value of the thermometer can directly represent the temperature of the measured object. Generally, the measurement accuracy is high. Within a certain temperature range, the thermometer can also measure the temperature distribution inside the object. However, large measurement errors will occur for moving bodies, small targets, or objects with small heat capacity. Commonly used thermometers include bimetallic thermometers, liquid-in-glass thermometers, pressure thermometers, resistance thermometers, thermistors, and thermocouples. They are widely used in industry, agriculture, commerce, and other sectors. People also often use these thermometers in daily life. With the wide application of cryogenic technology in national defense engineering, space technology, metallurgy, electronics, food, medicine, petrochemical, and other departments and the research of superconducting technology, cryogenic thermometers for measuring temperatures below 120K have been developed, such as cryogenic gas thermometers, steam Pressure thermometers, acoustic thermometers, paramagnetic salt thermometers, quantum thermometers, low-temperature thermal resistance, and low-temperature thermocouples, etc. Cryogenic thermometers require small temperature sensing elements, high accuracy, good reproducibility, and stability. The carburized glass thermal resistance made of porous high silica glass carburized and sintered is a kind of temperature sensing element of the low-temperature thermometer, which can be used to measure the temperature in the range of 1.6 ~ 300K. Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. Only the temperature measured for a black body (an object that absorbs all radiation and does not reflect light) is the true temperature. If you want to measure the real temperature of the object, you must correct the surface emissivity of the material. However, the surface emissivity of materials depends not only on temperature and wavelength, but also on surface state, coating film, and microstructure, so it is difficult to measure accurately. In automatic production, it is often necessary to use radiation thermometry to measure or control the surface temperature of certain objects, such as the steel strip rolling temperature, roll temperature, forging temperature in metallurgy, and the temperature of various molten metals in smelting furnaces or crucibles. In these specific cases, the measurement of the emissivity of an object's surface is quite difficult. For automatic measurement and control of solid surface temperature, an additional reflector can be used to form a black body cavity together with the measured surface. The effect of additional radiation can increase the effective radiation and effective emissivity of the measured surface. Use the effective emissivity coefficient to correct the measured temperature through the instrument, and finally get the real temperature of the measured surface. The most typical additional mirror is hemispherical. The diffuse radiation on the measured surface near the center of the sphere can be reflected on the surface by the hemispherical mirror to form additional radiation, thereby increasing the effective emissivity coefficient. In the formula, ε is the surface emissivity of the material, and ρ is the reflectivity of the mirror. As for the radiation measurement of the real temperature of the gas and liquid medium, the method of inserting the heat-resistant material tube to a certain depth to form a black body cavity can be used. The effective emission coefficient of the cylinder cavity after reaching thermal equilibrium with the medium is obtained by calculation. In automatic measurement and control, this value can be used to correct the measured cavity bottom temperature (ie medium temperature) to obtain the real temperature of the medium. Advantages of non-contact temperature measurement: the upper limit of measurement is not limited by the temperature resistance of the temperature sensing element, so there is no limit to the maximum measurable temperature in principle. For high temperatures above 1800°C, non-contact temperature measurement methods are mainly used. With the development of infrared technology, radiation temperature measurement has gradually expanded from visible light to infrared and has been used below 700°C to room temperature with high resolution. Working principle Metals undergo a corresponding extension when the ambient temperature changes, so the sensor can signal this response in different ways. Bimetal Sensor A bimetal sheet is composed of two pieces of metal with different expansion coefficients attached. As the temperature changes, material A expands more than the other metal, causing the metal sheet to bend. The curvature of the bend can be converted into an output signal. Bimetal Rod and Tube Sensors As the temperature increases, the length of the metal tube (material A) increases, while the length of the non-expanding steel rod (metal B) does not increase so that the linear expansion of the metal tube can be transmitted due to the change of position. In turn, this linear expansion can be translated into an output signal. Deformation Curve Design Sensors for Liquids and Gases When the temperature changes, liquids, and gases will also produce corresponding changes in volume. Various types of structures can convert this change in expansion into a change in position, thus producing a position change output (potentiometer, sense bias, baffle, etc.). Resistance sensing As the temperature of the metal changes, its resistance value also changes. For different metals, every time the temperature changes by one degree, the resistance value changes differently, and the resistance value can be directly used as an output signal. There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. For most thermocouples supported by metallic materials, this value is between 5 and 40 microvolts/°C. Since the sensitivity of the thermocouple temperature sensor has nothing to do with the thickness of the material, it can also be made into a temperature sensor with very thin materials. Also due to the good ductility of the metal material used to make thermocouples, this tiny temperature-measuring element has a very high response speed and can measure rapidly changing processes. Selection method If you want to make reliable temperature measurements, you first need to choose the correct temperature instrument, that is, the temperature sensor. Among them, thermocouples, thermistors, platinum resistance thermometers (RTDs), and temperature ICs are the most commonly used temperature sensors in testing. The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. Manufacturers do not give standardized thermistor curves. Thermistors are very small and respond quickly to changes in temperature. But the thermistor requires a current source, and its small size makes it extremely sensitive to self-heating errors. The thermistor measures absolute temperature on two lines and has better accuracy, but it is more expensive than a thermocouple, and its measurable temperature range is also smaller than that of a thermocouple. A commonly used thermistor has a resistance of 5kΩ at 25°C, and every 1°C temperature change causes a resistance change of 200Ω. Note that the 10Ω lead resistance causes only a negligible 0.05°C error. It is ideal for current control applications requiring fast and sensitive temperature measurements. The small size is advantageous for applications with space requirements, but care must be taken to prevent self-heating errors. Thermistors also have their measurement tricks. The advantage of the thermistor's small size is that it stabilizes quickly without causing a thermal load. However, it is also very weak, and a high current will cause self-heating. Since the thermistor is a resistive device, any current source will generate heat from power across it. Power is equal to the product of the square of the current and the resistance. So use a small current source. Permanent damage will result if the thermistor is exposed to high heat.
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