Manufacturer | Chip Quik Inc. |
Form | Spool, 1 lb (454 g) |
Type | Wire Solder |
Process | Leaded |
Diameter | 0.020" (0.51mm) |
Flux Type | No-Clean |
Mesh Type | - |
Shelf Life | - |
Wire Gauge | 24 AWG, 25 SWG |
Composition | Pb93.5Sn5Ag1.5 (93.5/5/1.5) |
Melting Point | 565 ~ 574°F (296 ~ 301°C) |
Product Status | Active |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |