Welcome to Hong Kong Bitfoic Electronics Co., Ltd
[email protected] Request a Quote Contact Us My order
en ru en ru en
LCMXO3LF-1300E-6MG256I
IMAGES ARE FOR REFERENCE ONLY
Favorite

LCMXO3LF-1300E-6MG256I

About Products
Due to the shortage of market environment and the price fluctuation, the displayed products can be inquired through RFQ, and we will reply within 24 hours
Quantity:
Quick Request Quote
Payment Methods
Delivery Services
Note: Since the price has fluctuated greatly from last year to the present, the price only for reference. Please submitan inquiry or sent email to [email protected] let us quote you a best price.
Specifications
LCMXO3LF-1300E-6MG256I details
Reviews
Packaging
Datasheets
LCMXO3LF-1300E-6MG256I Specifications
Manufacturer Lattice Semiconductor Corporation
Mounting Type Surface Mount
Number of I/O 206
Package / Case 256-VFBGA
Product Status Active
Total RAM Bits 65536
Number of Gates -
Voltage - Supply 1.14V ~ 1.26V
Number of LABs/CLBs 160
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 256-CSFBGA (9x9)
Number of Logic Elements/Cells 1280

LCMXO3LF-1300E-6MG256I FPGAs Overview

MachXO3 device family is an Ultra-Low Density family that supports the most advanced programmable bridging and IO expansion. It has the breakthrough IO density and the lowest cost per IO. The device IO features have the integrated support for latest industry standard IO.

The MachXO3L/LF family of low power, instant-on, non-volatile PLDs has five devices with densities ranging from 640 to 9400 Look-Up Tables (LUTs). In addition to LUT-based, low-cost programmable logic these devices feature Embedded Block RAM (EBR), Distributed RAM, Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support, advanced configuration support including dual-boot capability and hardened versions of commonly used functions such as SPI controller, I2C controller and timer/counter. MachXO3LF devices also support User Flash Memory (UFM). These features allow these devices to be used in low cost, high volume consumer and system applications.

The MachXO3L/LF devices are designed on a 65nm non-volatile low power process. The device architecture has several features such as programmable low swing differential I/Os and the ability to turn off I/O banks, on-chip PLLs and oscillators dynamically. These features help manage static and dynamic power consumption resulting in low static power for all members of the family.

The MachXO3L/LF devices are available in two versions C and E with two speed grades: -5 and -6, with -6 being the fastest. C devices have an internal linear voltage regulator which supports external VCC supply voltages of 3.3 V or 2.5 V. E devices only accept 1.2 V as the external VCC supply voltage. With the exception of power supply voltage both C and E are functionally compatible with each other.

The MachXO3L/LF PLDs are available in a broad range of advanced halogen-free packages ranging from the space saving 2.5 x 2.5 mm WLCSP to the 19 x 19 mm caBGA. MachXO3L/LF devices support density migration within the same package. Table 1-1 shows the LUT densities, package and I/O options, along with other key parameters

The MachXO3L/LF devices offer enhanced I/O features such as drive strength control, slew rate control, PCI compatibility, bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs and hot socketing. Pull-up, pull-down and bus-keeper features are controllable on a “per-pin” basis. A userprogrammable internal oscillator is included in MachXO3L/LF devices. The clock output from this oscillator may be divided by the timer/counter for use as clock input in functions such as LED control, key-board scanner and similar state machines. The MachXO3L/LF devices also provide flexible, reliable and secure configuration from on-chip NVCM/Flash. These devices can also configure themselves from external SPI Flash or be configured by an external master through the JTAG test access port or through the I2C port. Additionally, MachXO3L/LF devices support dual-boot capability (using external Flash memory) and remote field upgrade (TransFR) capability.

Lattice provides a variety of design tools that allow complex designs to be efficiently implemented using the MachXO3L/LF family of devices. Popular logic synthesis tools provide synthesis library support for MachXO3L/LF. Lattice design tools use the synthesis tool output along with the user-specified preferences and constraints to place and route the design in the MachXO3L/LF device. These tools extract the timing from the routing and back-annotate it into the design for timing verification.

Lattice provides many pre-engineered IP (Intellectual Property) LatticeCORE modules, including a number of reference designs licensed free of charge, optimized for the MachXO3L/LF PLD family. By using these configurable soft core IP cores as standardized blocks, users are free to concentrate on the unique aspects of their design, increasing their productivity.

The Lattice Embedded - FPGAs (Field Programmable Gate Array) series LCMXO3LF-1300E-6MG256I is IC FPGA 206 I/O 256CSFBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.

Features

1.1.1. Solutions

 Smallest footprint, lowest power, high data throughput bridging solutions for mobile applications

 Optimized footprint, logic density, IO count, IO performance devices for IO management and logic applications

 High IO/logic, lowest cost/IO, high IO devices for IO expansion applications

1.1.2. Flexible Architecture

 Logic Density ranging from 64 to 9.4K LUT4

 High IO to LUT ratio with up to 384 IO pins

1.1.3. Advanced Packaging

 0.4 mm pitch: 1K to 4K densities in very small footprint WLCSP (2.5 mm × 2.5 mm to 3.8 mm × 3.8 mm) with 28 to 63 IOs

 0.5 mm pitch: 640 to 9.4K LUT densities in 6 mm x 6 mm to 10 mm x 10 mm BGA packages with up to 281 IOs

 0.8 mm pitch: 1K to 9.4K densities with up to 384 IOs in BGA packages

1.1.4. Pre-Engineered Source Synchronous I/O

 DDR registers in I/O cells

 Dedicated gearing logic

 7:1 Gearing for Display I/Os

 Generic DDR, DDRx2, DDRx4

1.1.5. High Performance, Flexible I/O Buffer

 Programmable sysIO buffer supports wide range of interfaces:

 LVCMOS 3.3/2.5/1.8/1.5/1.2

 LVTTL

 LVDS, Bus-LVDS, MLVDS, LVPECL

 MIPI D-PHY Emulated

 Schmitt trigger inputs, up to 0.5 V hysteresis

 Ideal for IO bridging applications

 I/Os support hot socketing

 On-chip differential termination

 Programmable pull-up or pull-down mode

1.1.6. Flexible On-Chip Clocking

 Eight primary clocks

 Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)

 Up to two analog PLLs per device with fractional-n frequency synthesis

 Wide input frequency range (7 MHz to 400 MHz).

1.1.7. Non-volatile, Multi-time Programmable

 Instant-on

 Powers up in microseconds

 Optional dual boot with external SPI memory

 Single-chip, secure solution

 Programmable through JTAG, SPI or I2C

 MachXO3L includes multi-time programmable NVCM

 MachXO3LF reconfigurable Flash includes 100,000 write/erase cycle

 Supports background programming of non-volatile memory

1.1.8. TransFR Reconfiguration

 In-field logic update while IO holds the system state

1.1.9. Enhanced System Level Support

 On-chip hardened functions: SPI, I2C, timer/counter

 On-chip oscillator with 5.5% accuracy

 Unique TraceID for system tracking

 Single power supply with extended operating range

 IEEE Standard 1149.1 boundary scan

 IEEE 1532 compliant in-system programming

0 reviews
0.0
I Reviews
Write Your Own Review
Your Rating :
Nickname
Review
LCMXO3LF-1300E-6MG256I Packaging
  • step1-Inspect Products step1: Inspect Products
  • step2-Vacuum-Packaging step2: Vacuum Packaging
  • step3-Anti-Static Bag step3: Anti-Static Bag
  • step4-Individual Packing step4: Individual Packing
  • step5-Packing Box step5: Packing Box
  • step6-shipping tag step6:Shipping Tag
quzlity
  • Before shipping, we will inspect the parts to ensure it in good condition and check that the parts are brand-new and original with the datasheet. And then, all the products will be packed in an anti-static bag.
    After ensuring that there are no issues with any of the goods after packing, we will wrap them carefully and send them by international express. It demonstrates exceptional seal integrity, outstanding tear and puncture resistance, and both.
Related Tags
  • Lattice Semiconductor Corporation LCMXO3LF-1300E-6MG256I
  • LCMXO3LF-1300E-6MG256I Distributor
  • LCMXO3LF-1300E-6MG256I Supplier
  • LCMXO3LF-1300E-6MG256I Price
  • LCMXO3LF-1300E-6MG256I Pictures
  • LCMXO3LF-1300E-6MG256I Image
  • LCMXO3LF-1300E-6MG256I PDF Datasheet
  • LCMXO3LF-1300E-6MG256I Download Datasheet
  • LCMXO3LF-1300E-6MG256I Datasheet
  • LCMXO3LF-1300E-6MG256I Stock
  • Buy LCMXO3LF-1300E-6MG256I
  • Buy Lattice Semiconductor Corporation LCMXO3LF-1300E-6MG256I
  • Lattice Semiconductor Corporation LCMXO3LF-1300E-6MG256I
  • Lattice Semiconductor Corporation Supplier
  • Lattice Semiconductor Corporation Distributor
  • Lattice Semiconductor Corporation LCMXO3LF-1300E-6MG256I
  • Energy Micro LCMXO3LF-1300E-6MG256I
  • Lattice Semiconductor Corporation LCMXO3LF-1300E-6MG256I
  • Silicon Laboratories LCMXO3LF-1300E-6MG256I
  • Silicon Labs LCMXO3LF-1300E-6MG256I
Featured Manufacturer
Industry News
Ultra-low power consumption of STM32U575/585 microcontrollers(MCU)
The STM32U575/585 microcontrollers (MCU) are based on the high-performance Arm 32-bit Cortex‑M33CPU with Arm TrustZone and FPU.
TI(Texas Instruments)Advanced Ultrasonic Lens Cleaning Chipset Enables Self-Cleaning Cameras and Sensors
Computer vision and advanced imaging have enabled many revolutionary technologies, one of the most important being Advanced Driver Assistance Systems (ADAS) and autonomous vehicles.
The Best Guide to Transistor
The transistor is electronic equipment. It is made through a p and n-type semiconductor. When a semiconductor is placed in the center between the same type of semiconductors the arrangement is called transistors.
Electronic Component Symbols: Resistor, Capacitor, Transformers and Connectors
Electronic components are components of electronic components and small machines and instruments. They are often composed of several parts and can be used in similar products.
Diode Overview: Application in Automotive Alternator Rectifiers
Basic Information about Temperature Sensor
A temperature transducer is a sensor that can sense temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. After entering the 21st century, temperature sensors are rapidly developing towards high-tech directions such as high precision, multi-function, bus standardization, high reliability and safety, development of virtual sensors and network sensors, and development of single-chip temperature measurement systems. The bus technology of the temperature sensor has also been standardized, and it can be used as a slave to communicate with the host through a dedicated bus interface. According to the measurement method, it can be divided into two categories: a contact type and a non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. Main Category The detection part of the contact temperature sensor is in good contact with the measured object, also known as a thermometer. The thermometer achieves heat balance through conduction or convection so that the indication value of the thermometer can directly represent the temperature of the measured object. Generally, the measurement accuracy is high. Within a certain temperature range, the thermometer can also measure the temperature distribution inside the object. However, large measurement errors will occur for moving bodies, small targets, or objects with small heat capacity. Commonly used thermometers include bimetallic thermometers, liquid-in-glass thermometers, pressure thermometers, resistance thermometers, thermistors, and thermocouples. They are widely used in industry, agriculture, commerce, and other sectors. People also often use these thermometers in daily life. With the wide application of cryogenic technology in national defense engineering, space technology, metallurgy, electronics, food, medicine, petrochemical, and other departments and the research of superconducting technology, cryogenic thermometers for measuring temperatures below 120K have been developed, such as cryogenic gas thermometers, steam Pressure thermometers, acoustic thermometers, paramagnetic salt thermometers, quantum thermometers, low-temperature thermal resistance, and low-temperature thermocouples, etc. Cryogenic thermometers require small temperature sensing elements, high accuracy, good reproducibility, and stability. The carburized glass thermal resistance made of porous high silica glass carburized and sintered is a kind of temperature sensing element of the low-temperature thermometer, which can be used to measure the temperature in the range of 1.6 ~ 300K. Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. Only the temperature measured for a black body (an object that absorbs all radiation and does not reflect light) is the true temperature. If you want to measure the real temperature of the object, you must correct the surface emissivity of the material. However, the surface emissivity of materials depends not only on temperature and wavelength, but also on surface state, coating film, and microstructure, so it is difficult to measure accurately. In automatic production, it is often necessary to use radiation thermometry to measure or control the surface temperature of certain objects, such as the steel strip rolling temperature, roll temperature, forging temperature in metallurgy, and the temperature of various molten metals in smelting furnaces or crucibles. In these specific cases, the measurement of the emissivity of an object's surface is quite difficult. For automatic measurement and control of solid surface temperature, an additional reflector can be used to form a black body cavity together with the measured surface. The effect of additional radiation can increase the effective radiation and effective emissivity of the measured surface. Use the effective emissivity coefficient to correct the measured temperature through the instrument, and finally get the real temperature of the measured surface. The most typical additional mirror is hemispherical. The diffuse radiation on the measured surface near the center of the sphere can be reflected on the surface by the hemispherical mirror to form additional radiation, thereby increasing the effective emissivity coefficient. In the formula, ε is the surface emissivity of the material, and ρ is the reflectivity of the mirror. As for the radiation measurement of the real temperature of the gas and liquid medium, the method of inserting the heat-resistant material tube to a certain depth to form a black body cavity can be used. The effective emission coefficient of the cylinder cavity after reaching thermal equilibrium with the medium is obtained by calculation. In automatic measurement and control, this value can be used to correct the measured cavity bottom temperature (ie medium temperature) to obtain the real temperature of the medium. Advantages of non-contact temperature measurement: the upper limit of measurement is not limited by the temperature resistance of the temperature sensing element, so there is no limit to the maximum measurable temperature in principle. For high temperatures above 1800°C, non-contact temperature measurement methods are mainly used. With the development of infrared technology, radiation temperature measurement has gradually expanded from visible light to infrared and has been used below 700°C to room temperature with high resolution. Working principle Metals undergo a corresponding extension when the ambient temperature changes, so the sensor can signal this response in different ways. Bimetal Sensor A bimetal sheet is composed of two pieces of metal with different expansion coefficients attached. As the temperature changes, material A expands more than the other metal, causing the metal sheet to bend. The curvature of the bend can be converted into an output signal. Bimetal Rod and Tube Sensors As the temperature increases, the length of the metal tube (material A) increases, while the length of the non-expanding steel rod (metal B) does not increase so that the linear expansion of the metal tube can be transmitted due to the change of position. In turn, this linear expansion can be translated into an output signal. Deformation Curve Design Sensors for Liquids and Gases When the temperature changes, liquids, and gases will also produce corresponding changes in volume. Various types of structures can convert this change in expansion into a change in position, thus producing a position change output (potentiometer, sense bias, baffle, etc.). Resistance sensing As the temperature of the metal changes, its resistance value also changes. For different metals, every time the temperature changes by one degree, the resistance value changes differently, and the resistance value can be directly used as an output signal. There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. For most thermocouples supported by metallic materials, this value is between 5 and 40 microvolts/°C. Since the sensitivity of the thermocouple temperature sensor has nothing to do with the thickness of the material, it can also be made into a temperature sensor with very thin materials. Also due to the good ductility of the metal material used to make thermocouples, this tiny temperature-measuring element has a very high response speed and can measure rapidly changing processes. Selection method If you want to make reliable temperature measurements, you first need to choose the correct temperature instrument, that is, the temperature sensor. Among them, thermocouples, thermistors, platinum resistance thermometers (RTDs), and temperature ICs are the most commonly used temperature sensors in testing. The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. Manufacturers do not give standardized thermistor curves. Thermistors are very small and respond quickly to changes in temperature. But the thermistor requires a current source, and its small size makes it extremely sensitive to self-heating errors. The thermistor measures absolute temperature on two lines and has better accuracy, but it is more expensive than a thermocouple, and its measurable temperature range is also smaller than that of a thermocouple. A commonly used thermistor has a resistance of 5kΩ at 25°C, and every 1°C temperature change causes a resistance change of 200Ω. Note that the 10Ω lead resistance causes only a negligible 0.05°C error. It is ideal for current control applications requiring fast and sensitive temperature measurements. The small size is advantageous for applications with space requirements, but care must be taken to prevent self-heating errors. Thermistors also have their measurement tricks. The advantage of the thermistor's small size is that it stabilizes quickly without causing a thermal load. However, it is also very weak, and a high current will cause self-heating. Since the thermistor is a resistive device, any current source will generate heat from power across it. Power is equal to the product of the square of the current and the resistance. So use a small current source. Permanent damage will result if the thermistor is exposed to high heat.
3 Commonly Used EMC Components - Protection Devices
Voltage-Controlled Oscillator: Principle, Type Selection, and Application
Do you Know BD140 PNP Transistor: Pinout, Datasheet, Features and Applications
The BD140 is a medium power bipolar junction PNP transistor that is mainly used for audio amplifiers and drivers utilizing complementary or quasi-complementary circuits. It is made up of silicon and comes in the TO-126 package.