Manufacturer | Lattice Semiconductor Corporation |
Mounting Type | Surface Mount |
Number of I/O | 26 |
Package / Case | 36-XFBGA, WLCSP |
Product Status | Active |
Total RAM Bits | 81920 |
Number of Gates | - |
Voltage - Supply | 1.14V ~ 1.26V |
Number of LABs/CLBs | 440 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Supplier Device Package | 36-WLCSP (2.1x2.1) |
Number of Logic Elements/Cells | 3520 |
Flexible Logic Architecture
• Three devices with 1100 to 3520 LUTs
• Offered in WLCS, BGA and QFN packages
Ultra-low Power Devices
• Advanced 40 nm ultra-low power process
• As low as 71 µA standby current typical
Embedded Memory
• Up to 80 kbits sysMEM Embedded Block RAM
Two Hardened I2 C Interfaces
Two Hardened SPI Interfaces
Two On-Chip Oscillators
• Low Frequency Oscillator
– 10 kHz
• High Frequency Oscillator
– 48 MHz
24 mA Current Drive RGB LED Outputs
• Three drive outputs in each device
• User selectable sink current up to 24 mA
500 mA Current Drive IR LED Output
• One IR drive output in each device
• User selectable sink current up to 500 mA
On-chip DSP
• Signed and unsigned 8-bit or 16-bit functions
• Functions include Multiplier, Accumulator, and Multiply-Accumulate (MAC)
Flexible On-Chip Clocking
• Eight low skew global signal resource, six can be directly driven from external pins
• One PLL with dynamic interface per device
Flexible Device Configuration
• SRAM is configured through:
— Standard SPI Interface
— Internal Nonvolatile Configuration Memory (NVCM)
Ultra-Small Form Factor
• As small as 2.078 mm x 2.078 mm
Applications
• Smartphones
• Tablets and Consumer Handheld Devices
• Handheld Commercial and Industrial Devices
• Multi Sensor Management Applications
• Sensor Pre-processing and Sensor Fusion
• Always-On Sensor Applications
• USB 3.1 Type C Cable Detect / Power Delivery Applications