Manufacturer | Dialog Semiconductor GmbH |
GPIO | 6 |
Type | TxRx + MCU |
Protocol | Bluetooth v5.1 |
Frequency | 2.4GHz |
Modulation | - |
Memory Size | 48kB RAM, 144kB ROM |
Sensitivity | -94dBm |
Mounting Type | Surface Mount |
Package / Case | 17-XFBGA, WLCSP |
Power - Output | 2.5dBm |
Product Status | Active |
Data Rate (Max) | - |
Voltage - Supply | 1.1V ~ 3.3V |
Serial Interfaces | ADC, GPIO, I²C, SPI, UART |
RF Family/Standard | Bluetooth |
Current - Receiving | 2.2mA |
Operating Temperature | -40°C ~ 85°C |
Current - Transmitting | 3.5mA |
Supplier Device Package | 17-WLCSP (2.032x1.694) |
As a direct advantage to customers, Renesas and Dialog have now formally merged following the completion of Renesas' acquisition of Dialog. Highly integrated standard (ASSP) and bespoke (ASIC) mixed-signal integrated circuits (ICs) are made by Dialog Semiconductor and are tailored for Bluetooth® Smart, IoT, short-range wireless communication, smartphone, tablet, and LED solid state lighting (SSL) applications. The organization offers world-class innovation, flexible and responsive support, and the security of working with a reputable business partner.
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