Manufacturer | Multicore |
Form | Spool, 1 lb (454 g) |
Type | Wire Solder |
Process | Lead Free |
Diameter | 0.032" (0.81mm) |
Flux Type | No-Clean |
Mesh Type | - |
Shelf Life | - |
Wire Gauge | 20 AWG, 21 SWG |
Composition | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) |
Melting Point | 423°F (217°C) |
Product Status | Obsolete |
Shelf Life Start | - |
Storage/Refrigeration Temperature | 59°F ~ 86°F (15°C ~ 30°C) |
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
Chip Quik Inc.
MG Chemicals
Chip Quik Inc.