Some OEMs’ mature process quotations continue to fall

According to the Taiwan Economic Daily quoted by the Science and Technology Innovation Board, IC design manufacturers revealed that some wafer foundries have continued to lower their mature process quotations this quarter, by about 4% to 6%. Prices may be reduced again in the second quarter, bringing the cumulative decline in the first half of the year. About 10%.

Samsung is rumored to exclusively supply Nvidia’s 12-layer HBM3E memory

According to relevant reports cited by Kuai Technology, Nvidia will start purchasing large quantities of 12-layer HBM3E memory exclusively supplied by Samsung as early as September. SK Hynix has not been able to launch 12-layer HBM3E products due to some engineering problems but plans to start from the end of this month. Mass production of 8-layer HBM3E products.

On February 27 this year, Samsung Electronics officially announced that it had successfully developed the industry’s first 36GB 12-layer stacked HBM3E DRAM memory. Compared with the 8-layer stacked HBM3 8H, the bandwidth and capacity are increased by more than 50%, its AI training speed is increased by an average of 34%, and the number of inference service users can also be increased by more than 11.5 times.

Renesas releases RA2A2 microcontroller to help industrial energy management

Renesas released the RA2A2 microcontroller (MCU) group based on the Arm Cortex-M23 processor on March 21. The new low-power device offers a 24-bit Sigma-Delta analog-to-digital converter (SDADC), as well as innovative dual bank code flash and bank switching capabilities, making it easy to implement applications in smart energy management, building automation, medical devices, consumer Firmware over the air (FOTA) updates for electronics and other IoT applications that can benefit from firmware updates.

The RA2A2 series MCUs are available now, with FSP software and RA2A2 evaluation kits available.

Micron’s quarterly performance increased significantly and got rid of losses

On the 20th local time, Micron announced its second quarter results for fiscal year 2024, with revenue of US$5.82 billion, a year-on-year increase of 58%, and a quarter-on-quarter increase of 23%; net profit was US$793 million, a loss of US$2.312 billion in the same period last year, and a loss of US$1.234 billion in the previous quarter. US dollars; gross profit margin 18.5%.

Micron estimates third-quarter revenue of US$6.4-6.8 billion, with a median increase of 73.68% year-on-year and a month-on-month increase of 13.32%; gross profit margin is 25%-28%, with a median of 42.5 percentage points year-on-year and 6.5 percentage points month-on-month.

SMIC’s automotive chip reliability special testing center won CNAS certification

Local wafer foundry SMIC recently announced that its automotive chip reliability special testing center has passed the accreditation assessment of the China National Accreditation Service for Conformity Assessment (CNAS) and obtained the laboratory accreditation certificate and accreditation decision issued by it. This recognition certificate will provide strong support for the company to continue to rapidly launch vehicle-mounted process platforms.

The service scope of SMIC's automotive chip reliability special testing center covers SMIC process and IP, third-party IP or customer product testing capabilities. According to the AEC-Q100 standard, various testing capabilities related to the reliability of automotive products are configured. The testing center's testing capabilities include HTOL, TC, HAST, THB, and HTS, and can provide a full range of reliability testing services for automotive chips.

Texas Instruments launches new ultra-small MSPM0 controller

Texas Instruments (TI) recently released the ultra-small MSPM0C110x in the MSPM0 MCU series, which can be used in different applications in industrial, automotive, electrical appliances, and personal electronic products. The price is as low as 1 yuan for 1,000 pieces.

TI introduced that most existing 8-bit and 16-bit MCUs are based on traditional process nodes such as 180nm, and are gradually unable to meet market demand. The MSPM0C110x series MCU not only has a 32-bit ArmCortex-M0+ core but also achieves significant improvements in performance while maintaining extremely low costs. The ultra-compact design makes it a unique advantage in various space-sensitive applications.