1. ON Semiconductor establishes analog and mixed-signal division

Onsemi recently released news and announced the establishment of the Analog and Mixed-Signal Group (AMG), which will be led by Sudhir Gopalswamy, the newly appointed business unit president. The Analog and Mixed Signal Division focuses on developing a series of power management ICs and high-precision, low-power sensor interface and communication products. The division will focus on expanding ON Semiconductor's industry-leading power management and sensor interface product portfolio, unlocking new markets worth $19.3 billion and accelerating the company's growth in the automotive, industrial, and cloud markets.

The Analog and Mixed Signal Division merged the former Advanced Solutions Group (ASG) and the Integrated Circuit Division (ICD), part of the Power Solutions Division. Gopalswamy will lead both the Analog and Mixed-Signal Group and the Intelligent Sensing Group (ISG), which together generated nearly $4 billion in revenue last year. ON Semiconductor will release its financial report for the first quarter of 2024 based on the reorganized department structure and provide comparative historical data.

2. Samsung restores 70% capacity utilization of Xi’an flash memory factory

According to Korean media TheElec, Samsung has restored the operating rate of its wafer factory in Xi'an, China to 70%. The factory is Samsung's only overseas storage production factory and accounts for 40% of its total NAND flash memory production. This is in sharp contrast to rival SK Hynix, which is still reducing NAND flash memory production.

Sources said that in the second half of last year, the factory's operating rate dropped to 20%-30%, which was the lowest point since memory chip prices and demand began to decline in late 2022. Samsung also ordered more NAND flash memory components from Korean suppliers due to increased capacity utilization.

3. Phison CEO: It is recommended that NAND flash memory manufacturers stop cutting production

According to the Taiwan Electronic Times quoted by the Science and Technology Innovation Board Daily, Pan Jiancheng, CEO of NAND flash memory master manufacturer Phison, said that further price increases for SSD solid-state drives may seriously reduce market demand. If the price is too high, demand will begin to waver again, and suggested that NAND Manufacturers stop cutting production and start meeting demand, rather than letting low supply and high demand drive up prices.

4. TSMC launches a new wave of orders for CoWoS equipment

According to MoneyDJ news quoted by the Science and Technology Innovation Board Daily, TSMC has launched a new wave of order pursuits for CoWoS equipment factories this month, and the delivery time is expected to be the fourth quarter of this year.

Previously, TSMC restarted orders for CoWoS equipment in April 2023. The second and third waves of additional orders were in June and October last year respectively. After that, there were mostly sporadic orders. This month there is a new wave of active pursuit of orders. The market originally expected TSMC's CoWoS monthly production capacity to reach 32,000 to 35,000 pieces by the end of 2024, but now it is expected to exceed 40,000 pieces.

5. Infineon launches new CoolSiC MOSFET 2000 V

Infineon’s latest release of the new CoolSiC MOSFET 2000 V in the TO-247PLUS-4-HCC package not only meets designers’ needs for higher power density, but also does not degrade even in the face of strict high voltage and switching frequency requirements. System reliability, this product is suitable for solar (such as string inverter), energy storage systems, and electric vehicle charging applications.

The CoolSiC MOSFET 2000 V product family is now available. Infineon also provides the corresponding evaluation board EVAL-COOLSIC-2KVHCC. Developers can use this evaluation board as an accurate universal test platform to evaluate all CoolSiC MOSFETs and 2000 V diodes as well as the EiceDRIVER compact single-channel isolated gate driver 1ED31xx product family via dual-pulse or continuous PWM operation.

6. Transsion’s self-developed power chip is exposed and will be used in its mobile phones

According to Kuai Technology News, Infinix, a trendy technology brand specially developed for young consumers under Transsion Holdings, announced the launch of the first self-developed power management chip Cheetah X1. This innovative chip will form the basis for the new All-Round FastCharge 2.0 in its upcoming NOTE 40 series of smartphones.

Cheetah X1 uses wafer-level packaging technology to significantly reduce the chip size and become one of the smallest devices available. This technology shortens the signal transmission path and minimizes electrical signal delay, thereby enhancing electrical performance, especially in high-speed data transmission and high-frequency applications. As a result, the chip’s unit processing efficiency has increased by 204%. This advancement enables a charging experience in a variety of scenarios to meet different user needs and allows the phone to reduce excess weight while maintaining a powerful, portable and comfortable carrying experience.