CrossLinkPlus from Lattice Semiconductor is a programmable video bridging device that supports a variety of protocols and interfaces for mobile image sensors and displays. The device is based on Lattice mobile FPGA 40-nm technology with embedded flash. It is a low power FPGA with small footprint and instant boot up time (< 10 ms). 

CrossLinkPlus supports video interfaces including MIPI DPI, MIPI DBI, CMOS camera, and display interfaces, OpenLDI, FPD-Link, FLATLINK, MIPI D-PHY, MIPI CSI-2, MIPI DSI, SLVS200, subLVDS, HiSPi, and more. Lattice Semiconductor provides many pre-engineered Intellectual Property (IP) modules for CrossLinkPlus. 

By using these configurable soft core IPs as standardized blocks, you are free to concentrate on the unique aspects of your design, increasing the productivity. The Lattice Diamond design software allows large complex designs to be efficiently implemented using CrossLinkPlus. Synthesis library support for CrossLinkPlus devices is available for popular logic synthesis tools. The Diamond tools use the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the CrossLinkPlus device. The tools extract the timing from the routing and back-annotate it into the design for timing verification. Interfaces on CrossLinkPlus provide a variety of bridging solutions for smart phone, tablets, wearables, VR, AR, Drone, Smart Home, HMI as well as adjacent ISM markets. The device is capable of supporting high-resolution, high-bandwidth content for mobile cameras and displays at four UHD and beyond.

Features

 Ultra-low power

 Sleep mode support

 Normal Operation – from 5 mW to 150 mW

 Ultra small footprint packages

 64-ball ucfBGA (12 mm2) Programmable architecture

 5936 LUTs

 180 kb block RAM

 47 kb distributed RAM

 Two hardened 4-lane MIPI D-PHY interfaces

 Transmit and receive

 6 Gb/s per D-PHY interface

 Programmable source synchronous I/O

 MIPI D-PHY Rx, LVDS Rx, LVDS Tx, subLVDS Rx, SLVS200 Rx, HiSPi Rx

 Up to 1200 Mb/s per I/O

 Four high-speed clock inputs

 Programmable CMOS I/O

 LVTTL and LVCMOS

 3.3 V, 2.5 V, 1.8 V and 1.2 V (outputs)

 LVCMOS differential outputs

 Flexible device configuration

 On-chip reconfigurable Flash

 Master SPI boot from external flash

 Dual image booting supported

 I2C programming

 SPI programming

 TransFR I/O for simple field updates

 Enhanced system level support

 Reveal logic analyzer

 TraceID for system tracking

 On-chip hardened I2C block

 Applications examples

 Dual MIPI CSI-2 to Single MIPI CSI-2 Aggregation

 Quad MIPI CSI-2 to Single MIPI CSI-2 Aggregation

 Single MIPI DSI to Single MIPI DSI Repeater

 Single MIPI CSI-2 to Single MIPI CSI-2 Repeater

 Single MIPI DSI to Dual MIPI DSI Splitter

 Single MIPI CSI-2 to Dual MIPI CSI-2 Splitter

 MIPI DSI to OpenLDI/FPD-Link/LVDS Translator

 OpenLDI/FPD-Link/LVDS to MIPI DSI Translator

 MIPI DSI/CSI-2 to CMOS Translator

 CMOS to MIPI DSI/CSI-2 Translator

 subLVDS to MIPI CSI-2 Translator