Manufacturer | Chip Quik Inc. |
Form | Spool, 4 oz (113.40g) |
Type | Wire Solder |
Process | Lead Free |
Diameter | 0.020" (0.51mm) |
Flux Type | Rosin Activated (RA) |
Mesh Type | - |
Shelf Life | - |
Wire Gauge | 24 AWG, 25 SWG |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 422 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
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