ICE40LP1K-BLINK-EVN FPGAs Overview
Lattice's iCE40LP1K-BLINK-EVN Evaluation Kit��is a low-cost platform for evaluating and developing with the low-power ICE40LP1K-BLINK-EVN mobileFPGA���. The board provides access to general-purpose I/O and includes capacitive-touch buttons and LEDs. The board is powered and programmed via USB. An on-board microcontroller enables 2-way communication with the iCE40HX1K mobileFPGA. The free iCEcube2��� development tool controls programming, accesses virtual I/O functions, and runs the included demos.
The Lattice Programmable Logic IC Development Tools series ICE40LP1K-BLINK-EVN is Programmable Logic IC Development Tools 40-LP1K Eval Kit RoHS Compliant, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com,
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Features
Flexible Logic Architecture
• Five devices with 384 to 7,680 LUT4s and 10 to 206 I/Os
Ultra Low Power Devices
• Advanced 40 nm low power process
• As low as 21 µA standby power
• Programmable low swing differential I/Os
Embedded and Distributed Memory
• Up to 128 kbits sysMEM Embedded Block RAM
Pre-Engineered Source Synchronous I/O
• DDR registers in I/O cells
High Current LED Drivers
• Three High Current Drivers used for three different LEDs or one RGB LED
High Performance, Flexible I/O Buffer
• Programmable sysIO buffer supports wide range of interfaces:
— LVCMOS 3.3/2.5/1.8
— LVDS25E, subLVDS
— Schmitt trigger inputs, to 200 mV typical hysteresis
• Programmable pull-up mode
Flexible On-Chip Clocking
• Eight low-skew global clock resources
• Up to two analog PLLs per device
Flexible Device Configuration
• SRAM is configured through:
— Standard SPI Interface
— Internal Nonvolatile Configuration Memory (NVCM)
Broad Range of Package Options
• WLCSP, QFN, VQFP, TQFP, ucBGA, caBGA, and csBGA package options
• Small footprint package options
— As small as 1.40 mm x 1.48 mm
• Advanced halogen-free packaging